Graphics Synthesizer: Difference between revisions

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== Overview ==
== Overview ==
Also known short as GS.
The first revision released, CXD2934GB, is known to have been manufactured using a 180 nm process and to consume 19 W of power (calculated from the official information that the initially released [[Emotion Engine]] consumed 18 W of power and that EE and GS together initially consumed 37 W of power).
The first revision released, CXD2934GB, is known to have been manufactured using a 180 nm process and to consume 19 W of power (calculated from the official information that the initially released [[Emotion Engine]] consumed 18 W of power and that EE and GS together initially consumed 37 W of power).
There have been die-shrinks and optimizations over the years.


== Revisions ==
== Revisions ==
*CXD2934GB (metal IHS, GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016)
* 0.8: CXD2934GB
*CXD2944GB (plastic case, GH-004, GH-006, GH-008, GH-010, GH-013)
** 180 nm process, 188 mm² die size
*CXD2949GB (GH-015 - GH-023)
** 19 W power consumption
*CXD2949CGB (GH-026 - ?)
** metal IHS
*CXD2949DGB (? - GH-032-54 - ?)
** Copyright date: 1999
*...
** Used on [[motherboards]]: GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016
*CXD2972GB (PlayStation 3 COK-002)
** <imgur w=480>Ps9pRpU.jpg</imgur>
*CXD2980BGB (GS was made dedicated again after combining EE with RDRAM, IOP and other components instead, has no cooling at all besides airflow, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2)
* 1.5: CXD2944GB
** 108 mm² die size
** plastic case
** Copyright date: 2000
** Used on motherboards: GH-004, GH-006, GH-008, GH-010, GH-013
* 1.9: CXD2949GB / (reported as CXD2949BGB in PS2ident)
** 96 mm² die size
** Copyright date: 2001
** Used on motherboards: GH-015 - GH-023
* 1.11: CXD2949CGB
** 83 mm² die size
** Copyright date: 2002
** Used on motherboards: GH-023 - ?
* 1.11: CXD2949DGB
** 73 mm² die size
** Copyright date: 2003
** Used on motherboards: ? - GH-032-54 - ?
* CXD2972GB
** 49 mm² die size
** likely 90 nm process
** Copyright date: 2006
** Used on motherboards: PlayStation 3 COK-002/COK-002W (Models CECHC and CECHE)  
** Dieshots confirming that this is indeed just a GS and not an EE+GS variant (unlike EE+GS in CECHA and CECHB PS3 consoles)<br/>
<imgur w=240>0fB7Z5n.jpg</imgur> <imgur w=240>je066bM.jpg</imgur> <imgur w=240>2HjL1BY.jpg</imgur> <imgur w=240>TrNio8T.jpg</imgur> <br/>
* 1.15: CXD2980GB
** GS was made a separate IC again after combining EE with RDRAM, IOP and other components instead  
** Has no cooling at all besides airflow  
** Used on motherboards: GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2
* CXD2980BGB
** Copyright date: 2007
** Used on motherboards:
* 1.14: CXD2980CGB
** Used on motherboards:
 
== Specifications ==
* Parallel rendering processor with embedded DRAM "Graphics Synthesizer" (GS) clocked at 147.456&nbsp;MHz
* Programmable CRT controller (PCRTC) for output
* Pixel pipelines: 16 without any texture mapping units (TMU), however half of pixel pipelines can perform texturing, so fillrate is either 16 pixels per clock with untextured 2400 Mpixels; or 8 pixels per clock with 1200 megapixels with bilinear texturing, and 1200 megatexels (bilinear).
* Video output resolution: Variable from 256×224 to 1920×1080
* 4&nbsp;MB of embedded DRAM as video memory (an additional 32&nbsp;MB of main memory can be used as video memory); 48&nbsp;gigabytes per second peak bandwidth
** Texture buffer bandwidth: 9.6&nbsp;GB/s
** Frame buffer bandwidth: 38.4&nbsp;GB/s
* eDRAM bus width: 2560-bit (composed of three independent buses: 1024-bit write, 1024-bit read, 512-bit read/write)
* Pixel configuration: RGB:alpha, 24:8, 15:1; 16-, 24-, or 32-bit Z-buffer
* Display color depth: 32-bit (RGBA: 8 bits each)
* Dedicated connection to main CPU and VU1
* Overall pixel fillrate: 16 × 147&nbsp;Mpix/s = 2.352&nbsp;gigapixel/s
** 1.2 gigapixel/s (with Z-buffer, alpha, and texture)
** With no texture, flat shaded: 2.4&nbsp;Gpix/s (75,000,000 32-pixel raster triangles)
** With 1 full texture (diffuse map), Gouraud shaded: 1.2&nbsp;Gpix/s (37,750,000 32-bit pixel raster triangles)
** With 2 full textures (diffuse map and specular, alpha, or other), Gouraud shaded: 0.6&nbsp;Gpix/s (18,750,000 32-bit pixel raster triangles)
** Texture fillrate: 1.2&nbsp;Gtexel/s
** Sprite drawing rate: 18.75 million/s (8×8 pixels)
** Particle drawing rate: 150 million/s
* Polygon drawing rate: 75 million/s (small polygon)
** 50 million/s (48-pixel quad with Z and A)
** 30 million/s (50-pixel triangle with Z and A)
** 25 million/s (48-pixel quad with Z, A and T)
** 16 million/s (75-pixel triangle with Z, A, T and fog)
* VESA (maximum 1280×1024 pixels)
* 3 rendering paths (path 1, 2 and 3) GS effects include: Dot3 bump mapping (normal mapping), mipmapping, spherical harmonic lighting, alpha blending, alpha test, destination alpha test, depth test, scissor test, transparency effects, framebuffer effects, post-processing effects, perspective-correct texture mapping, edge-AAx2 (poly sorting required), bilinear, trilinear texture filtering, multi-pass, palletizing (6:1 ratio 4-bit; 3:1 ratio 8-bit), offscreen drawing, framebuffer mask, flat shading, Gouraud shading, cel shading, dithering, texture swizzling.
* Multi-pass rendering ability
** Four passes: 300&nbsp;Mpixel/s (300&nbsp;Mpixels/s divided by 32&nbsp;pixels = 9,375,000&nbsp;triangles/s lost every four passes)

Revision as of 03:10, 6 July 2022

Overview

Also known short as GS.

The first revision released, CXD2934GB, is known to have been manufactured using a 180 nm process and to consume 19 W of power (calculated from the official information that the initially released Emotion Engine consumed 18 W of power and that EE and GS together initially consumed 37 W of power).

There have been die-shrinks and optimizations over the years.

Revisions

  • 0.8: CXD2934GB
    • 180 nm process, 188 mm² die size
    • 19 W power consumption
    • metal IHS
    • Copyright date: 1999
    • Used on motherboards: GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016
    • <imgur w=480>Ps9pRpU.jpg</imgur>
  • 1.5: CXD2944GB
    • 108 mm² die size
    • plastic case
    • Copyright date: 2000
    • Used on motherboards: GH-004, GH-006, GH-008, GH-010, GH-013
  • 1.9: CXD2949GB / (reported as CXD2949BGB in PS2ident)
    • 96 mm² die size
    • Copyright date: 2001
    • Used on motherboards: GH-015 - GH-023
  • 1.11: CXD2949CGB
    • 83 mm² die size
    • Copyright date: 2002
    • Used on motherboards: GH-023 - ?
  • 1.11: CXD2949DGB
    • 73 mm² die size
    • Copyright date: 2003
    • Used on motherboards: ? - GH-032-54 - ?
  • CXD2972GB
    • 49 mm² die size
    • likely 90 nm process
    • Copyright date: 2006
    • Used on motherboards: PlayStation 3 COK-002/COK-002W (Models CECHC and CECHE)
    • Dieshots confirming that this is indeed just a GS and not an EE+GS variant (unlike EE+GS in CECHA and CECHB PS3 consoles)

<imgur w=240>0fB7Z5n.jpg</imgur> <imgur w=240>je066bM.jpg</imgur> <imgur w=240>2HjL1BY.jpg</imgur> <imgur w=240>TrNio8T.jpg</imgur>

  • 1.15: CXD2980GB
    • GS was made a separate IC again after combining EE with RDRAM, IOP and other components instead
    • Has no cooling at all besides airflow
    • Used on motherboards: GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2
  • CXD2980BGB
    • Copyright date: 2007
    • Used on motherboards:
  • 1.14: CXD2980CGB
    • Used on motherboards:

Specifications

  • Parallel rendering processor with embedded DRAM "Graphics Synthesizer" (GS) clocked at 147.456 MHz
  • Programmable CRT controller (PCRTC) for output
  • Pixel pipelines: 16 without any texture mapping units (TMU), however half of pixel pipelines can perform texturing, so fillrate is either 16 pixels per clock with untextured 2400 Mpixels; or 8 pixels per clock with 1200 megapixels with bilinear texturing, and 1200 megatexels (bilinear).
  • Video output resolution: Variable from 256×224 to 1920×1080
  • 4 MB of embedded DRAM as video memory (an additional 32 MB of main memory can be used as video memory); 48 gigabytes per second peak bandwidth
    • Texture buffer bandwidth: 9.6 GB/s
    • Frame buffer bandwidth: 38.4 GB/s
  • eDRAM bus width: 2560-bit (composed of three independent buses: 1024-bit write, 1024-bit read, 512-bit read/write)
  • Pixel configuration: RGB:alpha, 24:8, 15:1; 16-, 24-, or 32-bit Z-buffer
  • Display color depth: 32-bit (RGBA: 8 bits each)
  • Dedicated connection to main CPU and VU1
  • Overall pixel fillrate: 16 × 147 Mpix/s = 2.352 gigapixel/s
    • 1.2 gigapixel/s (with Z-buffer, alpha, and texture)
    • With no texture, flat shaded: 2.4 Gpix/s (75,000,000 32-pixel raster triangles)
    • With 1 full texture (diffuse map), Gouraud shaded: 1.2 Gpix/s (37,750,000 32-bit pixel raster triangles)
    • With 2 full textures (diffuse map and specular, alpha, or other), Gouraud shaded: 0.6 Gpix/s (18,750,000 32-bit pixel raster triangles)
    • Texture fillrate: 1.2 Gtexel/s
    • Sprite drawing rate: 18.75 million/s (8×8 pixels)
    • Particle drawing rate: 150 million/s
  • Polygon drawing rate: 75 million/s (small polygon)
    • 50 million/s (48-pixel quad with Z and A)
    • 30 million/s (50-pixel triangle with Z and A)
    • 25 million/s (48-pixel quad with Z, A and T)
    • 16 million/s (75-pixel triangle with Z, A, T and fog)
  • VESA (maximum 1280×1024 pixels)
  • 3 rendering paths (path 1, 2 and 3) GS effects include: Dot3 bump mapping (normal mapping), mipmapping, spherical harmonic lighting, alpha blending, alpha test, destination alpha test, depth test, scissor test, transparency effects, framebuffer effects, post-processing effects, perspective-correct texture mapping, edge-AAx2 (poly sorting required), bilinear, trilinear texture filtering, multi-pass, palletizing (6:1 ratio 4-bit; 3:1 ratio 8-bit), offscreen drawing, framebuffer mask, flat shading, Gouraud shading, cel shading, dithering, texture swizzling.
  • Multi-pass rendering ability
    • Four passes: 300 Mpixel/s (300 Mpixels/s divided by 32 pixels = 9,375,000 triangles/s lost every four passes)