Graphics Synthesizer: Difference between revisions
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| Line 9: | Line 9: | ||
** metal IHS | ** metal IHS | ||
** Copyright date: 1999 | ** Copyright date: 1999 | ||
** GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016 | ** Used on [[motherboards]]: GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016 | ||
* 1.5: CXD2944GB | * 1.5: CXD2944GB | ||
** 108 mm² die size | ** 108 mm² die size | ||
** plastic case | ** plastic case | ||
** Copyright date: 2000 | ** Copyright date: 2000 | ||
** GH-004, GH-006, GH-008, GH-010, GH-013 | ** Used on motherboards: GH-004, GH-006, GH-008, GH-010, GH-013 | ||
* 1.9: CXD2949GB / (reported as CXD2949BGB in PS2ident) | * 1.9: CXD2949GB / (reported as CXD2949BGB in PS2ident) | ||
** 96 mm² die size | ** 96 mm² die size | ||
** Copyright date: 2001 | ** Copyright date: 2001 | ||
** GH-015 - GH-023 | ** Used on motherboards: GH-015 - GH-023 | ||
* 1.11: CXD2949CGB | * 1.11: CXD2949CGB | ||
** 83 mm² die size | ** 83 mm² die size | ||
** Copyright date: 2002 | ** Copyright date: 2002 | ||
** GH-023 - ? | ** Used on motherboards: GH-023 - ? | ||
* 1.11: CXD2949DGB | * 1.11: CXD2949DGB | ||
** 73 mm² die size | ** 73 mm² die size | ||
** Copyright date: 2003 | ** Copyright date: 2003 | ||
** ? - GH-032-54 - ? | ** Used on motherboards: ? - GH-032-54 - ? | ||
* CXD2972GB | * CXD2972GB | ||
** Copyright date: 2006 | ** Copyright date: 2006 | ||
** PlayStation 3 COK-002 | ** Used on motherboards: PlayStation 3 COK-002 | ||
* 1.15: CXD2980GB | * 1.15: CXD2980GB | ||
** GS was made dedicated again after combining EE with RDRAM, IOP and other components instead, has no cooling at all besides airflow, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2 | ** GS was made dedicated again after combining EE with RDRAM, IOP and other components instead, has no cooling at all besides airflow, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2 | ||
| Line 35: | Line 35: | ||
** Copyright date: 2007 | ** Copyright date: 2007 | ||
* 1.14: CXD2980CGB | * 1.14: CXD2980CGB | ||
**Used on motherboards: | |||
Revision as of 21:09, 14 February 2022
Overview
The first revision released, CXD2934GB, is known to have been manufactured using a 180 nm process and to consume 19 W of power (calculated from the official information that the initially released Emotion Engine consumed 18 W of power and that EE and GS together initially consumed 37 W of power).
There have been die-shrinks and optimizations over the years.
Revisions
- 0.8: CXD2934GB
- 180 nm process, 188 mm² die size
- metal IHS
- Copyright date: 1999
- Used on motherboards: GH-001, GH-003, GH-005, GH-007, GH-012, GH-014, GH-016
- 1.5: CXD2944GB
- 108 mm² die size
- plastic case
- Copyright date: 2000
- Used on motherboards: GH-004, GH-006, GH-008, GH-010, GH-013
- 1.9: CXD2949GB / (reported as CXD2949BGB in PS2ident)
- 96 mm² die size
- Copyright date: 2001
- Used on motherboards: GH-015 - GH-023
- 1.11: CXD2949CGB
- 83 mm² die size
- Copyright date: 2002
- Used on motherboards: GH-023 - ?
- 1.11: CXD2949DGB
- 73 mm² die size
- Copyright date: 2003
- Used on motherboards: ? - GH-032-54 - ?
- CXD2972GB
- Copyright date: 2006
- Used on motherboards: PlayStation 3 COK-002
- 1.15: CXD2980GB
- GS was made dedicated again after combining EE with RDRAM, IOP and other components instead, has no cooling at all besides airflow, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2
- CXD2980BGB
- Copyright date: 2007
- 1.14: CXD2980CGB
- Used on motherboards: